When you shrink down to very small scales, heat doesn’t always behave the way you think it should. Now, new findings from the nano realm could help researchers to gain a better handle on the flow of heat in electronic devices.
A team of physicists at CU Boulder has solved the mystery behind a perplexing phenomenon in the nano realm: why some ultra-small heat sources cool down faster if you pack them closer together. The findings, published today in the journal Proceedings of the National Academy of Sciences (PNAS), could one day help the tech industry design faster electronic devices that overheat less.
“Often, heat is a challenging consideration in designing electronics...
Read More
Recent Comments