multi-function chiplets tagged posts

Intel introduces approach to Boost Power Efficiency, Reliability of Packaged Chiplet Ecosystems

Intel introduces an approach to boost the power-efficiency and reliability of packaged chiplet ecosystems
Credit: Das Sharma et al

The integration of electronic chips in commercial devices has significantly evolved over the past decades, with engineers devising various integration strategies and solutions. Initially, computers contained a central processor or central processing unit (CPU), connected to memory units and other components via traditional communication pathways, known as front-side-bus (FSB) interfaces.

Technological advances, however, have enabled the development of new integrated circuit (IC) architectures relying on multiple chiplets and more sophisticated electronic components. Intel Corporation played a crucial role in these developments, by introducing new architectures and specifications for the design of systems with multiple packaged chiplets.

Researchers at Int...

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