The rapid advancement in photonic integrated circuits (PICs), which combine multiple optical devices and functionalities on a single chip, has revolutionized optical communications and computing systems.
For decades, silicon-based PICs have dominated the field due to their cost-effectiveness and through their integration with existing semiconductor manufacturing technologies, despite their limitations with regard to their electro-optical modulation bandwidth. Nevertheless, silicon-on-insulator optical transceiver chips were successfully commercialized, driving information traffic through millions of glass fibers in modern data centers.
Recently, the lithium niobate-on-insulator wafer platform has emerged as a superior material for photonic integrated electro-optical modulators d...
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