wafer-scale materials opens up opportunities in flexible electronics tagged posts

Researchers in MIT’s Department of Mechanical Engineering have developed a technique to harvest 2-inch diameter wafers of 2-D material within just a few minutes.
Credit: Peng Lin

Efficient method for making single-atom-thick, wafer-scale materials opens up opportunities in flexible electronics. Researchers have developed a technique to harvest 2-inch diameter wafers of 2-D material within just a few minutes. They can then be stacked together to form an electronic device within an hour.

Since the 2003 discovery of graphene, there has been significant interest in other types of 2-D materials as well. These materials could be stacked together like Lego bricks to form a range of devices with different functions, including operating as semiconductors...