y increase the density and computing power of electronics tagged posts

DNA scaffolds enable self-assembling 3D electronic devices

DNA helps electronics to leave flatland
Chip-integrated 3D nanostructured device fabricated using DNA self-assembly (Left panel). A DNA crystal is grown at a designated substrate location (about 1000 crystals on 5μm pads are shown on a Right panel), then mineralized to silica and volumetrically templated with a semiconductor material before electrodes are attached (Center panel). The resulting device exhibits an electrical response when exposed to light. Thousands of such 3D devices can be grown in parallel using this bottom-up fabrication approach. Credit: Center for Functional Nanomaterials

Researchers at Columbia Engineering have for the first time used DNA to help create 3D electronically operational devices with nanometer-size features.

“Going from 2D to 3D can dramatically increase the density and computing power o...

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