Category Technology/Electronics

Transforming Biology to design Next-generation computers, using a surprise ingredient

A Purdue University group has found ways of transforming structures that occur naturally in cell membranes to create other architectures, like parallel 1nm-wide line segments, more applicable to computing. 

Researchers turned to biology to help in the design of next-generation computers. Moore’s law – which says the number of components that could be etched onto the surface of silicon wafer would double every two years – has been the subject of recent debate. The quicker pace of computing advancements in the past decade have led some experts to say Moore’s law, the brainchild of Intel co-founder Gordon Moore in the 1960s, no longer applies...

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Ultrathin Transistors for Faster Computer Chips

Eine schematische Skizze des neuen Transistors: In rot-blau: der Isolator, darüber der Halbleiter
Transistor
Schematics of the new transistor: the insulator in red and blue, and the semiconductor above (Copyright: TU Wien, permission to reprint)

The next big miniaturization step in microelectronics could soon become possible — with so-called 2D materials. With the help of a novel insulator made of calcium fluoride, scientists have created an ultra-thin transistor, which has excellent electrical properties and, in contrast to previous technologies, can be miniaturized to an extremely small size.

For decades, the transistors on our microchips have become smaller, faster and cheaper. Approximately every two years the number of transistors on commercial chips has doubled – this phenomenon became known as “Moore’s Law...

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New Multi-Material 3D Nanoprinting Strategy could Revolutionize Optics, Photonics and Biomedicine

Engineers at the University of Maryland (UMD) have created a new multi-material 3-D nanoprinting technique that was featured on the inside front cover of the July 21 issue of Lab on a Chip.

Engineers at the University of Maryland (UMD) have created a new multi-material 3D nanoprinting technique that was featured on the inside front cover of the July 21 issue of Lab on a Chip.

The team’s new technique—capable of printing tiny multi-material structures a fraction of the size of a human hair—offers researchers a faster, cheaper, and more accurate means to 3D print these highly complex structures because the process uses a very simple molding process that is widely used in most microfluidics labs.

To demonstrate their new approach, the researchers 3D nanoprinted a variety of mu...

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Search for New Semiconductors Heats up with Gallium Oxide

An artist rendering of the MacEtch-produced fin array structures in a beta-gallium oxide semiconductor substrate from professor Xiuling Li’s latest project.
Image courtesy ACS Nano

University of Illinois electrical engineers have cleared another hurdle in high-power semiconductor fabrication by adding the field’s hottest material – beta-gallium oxide – to their arsenal. Beta-gallium oxide is readily available and promises to convert power faster and more efficiently than today’s leading semiconductor materials – gallium nitride and silicon, the researchers said. Their findings are published in the journal ACS Nano.

Flat transistors have become about as small as is physically possible, but researchers addressed this problem by going vertical...

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