World’s first N-Channel Diamond Field-Effect Transistor for CMOS Integrated Circuits

World's first N-channel diamond field-effect transistor for CMOS integrated circuits

A National Institute for Materials Science (NIMS) research team has developed the world’s first n-channel diamond MOSFET (metal-oxide-semiconductor field-effect transistor). The developed n-channel diamond MOSFET provides a key step toward CMOS (complementary metal-oxide-semiconductor: one of the most popular technologies in the computer chip) integrated circuits for harsh environment applications, as well as the development of diamond power electronics. The research is published in Advanced Science.

Semiconductor diamond has outstanding physical properties such as ultra wide-bandgap energy of 5...

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Einasto Supercluster: The New Heavyweight Contender in the Universe

Einasto Supercluster: the new heavyweight contender in the universe
Einasto supercluster. Credit: Shishir Sankhyayan

An international team of scientists led by astronomers from Tartu Observatory of the University of Tartu has discovered many superclusters in the universe, with the most prominent among them named the ‘Einasto Supercluster’ in honor of Prof. Jaan Einasto, a pioneering figure in the field, who celebrated his 95th birthday on 23 February.

Superclusters, akin to vast metropolitan cities in space, represent the largest and most massive collections and clusters of galaxies in the universe. The team’s findings not only expanded our understanding of these vast structures but also paved the path to shed light on the ongoing mystery of their formation.

In their study, the scientists determined that the typical mass of superclusters is an as...

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Neurobiologists Uncover how Stress turns into Fear in the Brain in Conditions such as PTSD

Our nervous systems are naturally wired to sense fear. Whether prompted by the eerie noises we hear alone in the dark or the approaching growl of a threatening animal, our fear response is a survival mechanism that tells us to remain alert and avoid dangerous situations.Read More

Intel introduces approach to Boost Power Efficiency, Reliability of Packaged Chiplet Ecosystems

Intel introduces an approach to boost the power-efficiency and reliability of packaged chiplet ecosystems
Credit: Das Sharma et al

The integration of electronic chips in commercial devices has significantly evolved over the past decades, with engineers devising various integration strategies and solutions. Initially, computers contained a central processor or central processing unit (CPU), connected to memory units and other components via traditional communication pathways, known as front-side-bus (FSB) interfaces.

Technological advances, however, have enabled the development of new integrated circuit (IC) architectures relying on multiple chiplets and more sophisticated electronic components. Intel Corporation played a crucial role in these developments, by introducing new architectures and specifications for the design of systems with multiple packaged chiplets.

Researchers at Int...

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