integrated circuit (IC) tagged posts

Intel introduces approach to Boost Power Efficiency, Reliability of Packaged Chiplet Ecosystems

Intel introduces an approach to boost the power-efficiency and reliability of packaged chiplet ecosystems
Credit: Das Sharma et al

The integration of electronic chips in commercial devices has significantly evolved over the past decades, with engineers devising various integration strategies and solutions. Initially, computers contained a central processor or central processing unit (CPU), connected to memory units and other components via traditional communication pathways, known as front-side-bus (FSB) interfaces.

Technological advances, however, have enabled the development of new integrated circuit (IC) architectures relying on multiple chiplets and more sophisticated electronic components. Intel Corporation played a crucial role in these developments, by introducing new architectures and specifications for the design of systems with multiple packaged chiplets.

Researchers at Int...

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A CMOS-based chip that integrates silicon quantum dots and multiplexed readout electronics

Microscopy photo of chip with bond wires. Credit: Ruffino et al.

Researchers at École Polytechnique Fédérale de Lausanne (EPFL) and the Hitachi Cambridge Laboratory have recently designed an integrated circuit (IC) that integrates silicon quantum dots with conventional readout electronics. This chip, introduced in a paper published in Nature Electronics, is based on a 40-nm cryogenic complementary metal-oxide semiconductor (CMOS) technology that is readily and commercially available.

“Our recent paper builds on the expertise of the two groups involved,” Andrea Ruffino, one of the researchers at EPFL who carried out the study, told TechXplore...

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