AI data centers are power-hungry. Not only do artificial intelligence computations consume enormous amounts of electricity, but a significant amount of energy is also required to cool the semiconductor chips that heat up during operation. As AI chips continue to deliver higher performance, the amount of heat they generate increases rapidly. As a result, conventional air cooling and external copper heat spreaders are approaching their practical limits. To address this challenge, a KAIST research team has developed an ultra-high-efficiency liquid-cooling technology that cools semiconductor chips from within.
A joint research team led by Professor Sung Jin Kim of the Department of Mechanical Engineering and Professor Ikjin Lee of the School of AI and Computing has developed a highly e...
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