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New memory survives temperatures hotter than lava

Novel memory chip survives temperatures hotter than lava
Gra/HfOx/W device and cross-section image. a, optical image of a single device with ~1 um ×1 um device size. b, cross-section TEM image and EELS mapping of W, Hf and C elements. Credit: Science (2026). DOI: 10.1126/science.aeb9934

The electronics inside your phone, your car, and every satellite currently orbiting Earth share one critical weakness: heat. Push them past about 200 degrees Celsius and they start to fail. For decades, that thermal ceiling has been one of the hardest walls in engineering. Now a team at the University of Southern California may have just found a way around it.

In a study published in Science, researchers led by Joshua Yang, Arthur B...

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